potting materials
epoxy resins / polyurethane / silicones / thermally conductive pastes
thermally conductive pastes
The purpose of these materials is to reliably conduct away heat arising between components. Increases in miniaturisation mean that electronic components are getting ever smaller, meaning this function is becoming ever more challenging. To optimize the cooling properties of sensitive, temperature-affected parts, exact dispensing is required of even the smallest quantities.
key properties
- What are used are paste-like or two-component potting media based on silicone, epoxy or polyurethane, enriched with heat-conductive fillers.
- The goal of potting with thermally conductive pastes is to prevent power loss and defects, increase service life and improve reliability.
- With additives and fillers, the funcitonality of the paste can be altered to fit the application.
- he most important figure is the specific coefficient of thermal conduction, also called thermal conductivity, with unit W/ (m∙K). The size of this value indicates how much heat can be transferred per time unit (the higher the greater).
questions and answers
What is thermal paste and what is it used for?
A: Paste-like one- or two-component potting compounds based on silicone, epoxy, or polyurethane are used, which are enriched with thermally conductive fillers. These potting compounds serve the purpose of reliably dissipating heat between components. Due to the ongoing miniaturization of electronic components, they are becoming smaller, making this functionality increasingly challenging.
What is thermal conductivity and how is it measured?
A: Thermal conductivity is a physical property of materials that indicates how well they can transfer heat. High thermal conductivity allows efficient heat transfer from a warmer area to a cooler one. It is typically measured in thermal conductivity coefficients (Lambda value or k-value) with the unit Watt per meter per Kelvin (W/(m·K)).
How do materials affect thermal conductivity?
A: Bonding type – Strong bonds, like those in metals, conduct heat more efficiently than weak bonds, like those in non-metals.
Crystal structure – Regular crystal structures, like those in metals, have higher thermal conductivity than disordered structures, like glass.
Density – Materials with higher density conduct heat better, as particles are closer together.
Moisture content – Higher moisture content often reduces thermal conductivity compared to dry materials.
Additives and impurities – Foreign ions disrupt heat conduction, reducing thermal conductivity.
Temperature – The thermal conductivity of many materials increases with rising temperature.
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