thermally conductive pastes
The purpose of these materials is to reliably conduct away heat arising between components. Increases in miniaturisation mean that electronic components are getting ever smaller, meaning this function is becoming ever more challenging. To optimize the cooling properties of sensitive, temperature-affected parts, exact dispensing is required of even the smallest quantities.
- What are used are paste-like or two-component potting media based on silicone, epoxy or polyurethane, enriched with heat-conductive fillers.
- The goal of potting with thermally conductive pastes is to prevent power loss and defects, increase service life and improve reliability.
- With additives and fillers, the funcitonality of the paste can be altered to fit the application.
- he most important figure is the specific coefficient of thermal conduction, also called thermal conductivity, with unit W/ (m∙K). The size of this value indicates how much heat can be transferred per time unit (the higher the greater).
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