dispensing processes
sealing / bonding / potting / encapsulation/ insulation / thermal management
encapsulation
Encapsulation – a protective layer for sensitive parts
Encapsulation means covering the sensitive surfaces of electrical products and electronic components with a very thin layer of material. Here, as a rule, low-viscosity protective varnishes or casting resins are used to achieve an even distribution of material. An exact encapsulation is applied to fit the specific requirements. The material/layer thickness can be from the micrometre range to a few millimetres depending on the design and protective function.
Here too, the task is to keep harmful environmental influences away from the part such as damp, chemicals, organic material such as bacteria or soiling of all kinds. Increasing stability and robustness are also goals here. Encapsulation also allows conductors to be placed closer together and achieves a higher SIR – surface insulation resistance. It is essential that the entire surface is covered up to its edges and including sharp-edged structures and soldered connections. sharp-edged structures and soldered connections. This is achieved through the use of low-viscosity sealing compounds.
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